Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424550 | Multi-band antenna package structure, manufacturing method thereof and communication device | Yen-Cheng Kuan, Chia-Jen Liang, Chien-Te Yu | 2019-09-24 |
| 10361154 | Variable inductor and integrated circuit using the variable inductor | Chia-Jen Liang, Yen-Cheng Kuan, Chien-Te Yu | 2019-07-23 |
| 10298182 | Radio frequency amplifier and integrated circuit using the radio frequency amplifier | Chia-Jen Liang, Yen-Cheng Kuan, Hung-Ting Chou | 2019-05-21 |
| 10277170 | Radio frequency amplifier and integrated circuit using the radio frequency amplifier | Chia-Jen Liang, Yen-Cheng Kuan, Hung-Ting Chou | 2019-04-30 |
| 10249562 | Package structure and fabrication method thereof | Kuang-Hsin Chen, Hsien-Wen Chen | 2019-04-02 |
| 10236227 | Electronic package and fabrication method thereof | Lung-Shan Chuang, Tzung-Yen Wu, Chun-Hung Lu | 2019-03-19 |
| 10199320 | Method of fabricating electronic package | Kuang-Hsin Chen, Sheng-Li Lu, Hsien-Wen Chen | 2019-02-05 |
| 10199345 | Method of fabricating substrate structure | Hsin-Ta Lin | 2019-02-05 |