Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10236227 | Electronic package and fabrication method thereof | Ching-Wen Chiang, Tzung-Yen Wu, Chun-Hung Lu | 2019-03-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10236227 | Electronic package and fabrication method thereof | Ching-Wen Chiang, Tzung-Yen Wu, Chun-Hung Lu | 2019-03-19 |