Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461002 | Fabrication method of electronic module | Lu-Yi Chen, Chang-Lun Lu | 2019-10-29 |
| 10434707 | Touch substrate manufactured by three-dimensional printing and method for manufacturing the same | Shun-Jie Yang, Shun-Ta Chien, Wen-Fu Huang | 2019-10-08 |
| 10403596 | Method of fabricating packaging structure | Hsien-Wen Chen, Chieh-Lung Lai | 2019-09-03 |
| 10242972 | Package structure and fabrication method thereof | Lu-Yi Chen, Chang-Lun Lu, Guang-Hwa Ma, Cheng-Hsu Hsiao | 2019-03-26 |