Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10460983 | Method for manufacturing a bonded SOI wafer | Taishi WAKABAYASHI, Kenji Meguro, Shinichiro Yagi, Tomosuke Yoshida | 2019-10-29 |
| 10424484 | Method for manufacturing a bonded SOI wafer | Toru Ishizuka, Norihiro Kobayashi | 2019-09-24 |