Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490440 | Method for manufacturing bonded SOI wafer | Hiroji Aga | 2019-11-26 |
| 10424484 | Method for manufacturing a bonded SOI wafer | Toru Ishizuka, Masatake Nakano | 2019-09-24 |
| 10204824 | Method for producing SOI wafer | Isao Yokokawa, Hiroji Aga | 2019-02-12 |