Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10460983 | Method for manufacturing a bonded SOI wafer | Taishi WAKABAYASHI, Kenji Meguro, Masatake Nakano, Shinichiro Yagi | 2019-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10460983 | Method for manufacturing a bonded SOI wafer | Taishi WAKABAYASHI, Kenji Meguro, Masatake Nakano, Shinichiro Yagi | 2019-10-29 |