Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497602 | Process of forming an electronic device including forming an electronic component and removing a portion of a substrate | Ali Salih | 2019-12-03 |
| 10461028 | Semiconductor device including a vertical one-time programmable fuse that includes a conductive layer and a resistive material and a method of making the same | Jefferson W. Hall | 2019-10-29 |
| 10446446 | Method of separating electronic devices having a back layer and apparatus | — | 2019-10-15 |
| 10373869 | Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus | Hou Nion Chan | 2019-08-06 |
| 10366923 | Method of separating electronic devices having a back layer and apparatus | — | 2019-07-30 |
| 10355125 | Electrode contact structure for semiconductor device | — | 2019-07-16 |
| 10347656 | Semiconductor device and monolithic semiconductor device including a power semiconductor device and a control circuit | Jefferson W. Hall | 2019-07-09 |
| 10340160 | Method of forming a semiconductor die cutting tool | John Michael Parsey, Jr. | 2019-07-02 |
| 10297427 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman | 2019-05-21 |
| 10269642 | Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface | — | 2019-04-23 |
| 10211060 | Semiconductor device and manufacturing method thereof | Michael Thomason, Mohammed Tanvir Quddus, James Morgan, Mihir Mudholkar, Scott Donaldson | 2019-02-19 |