Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497621 | Method for dicing a substrate with back metal | Peter Falvo, Linnell Martinez, Rich Gauldin, Russell Westerman | 2019-12-03 |
| 10297427 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna | 2019-05-21 |