HC

Hou Nion Chan

ON onsemi: 1 patents #155 of 388Top 40%
📍 Ipoh, MY: #3 of 17 inventorsTop 20%
Overall (2019): #442,874 of 560,194Top 80%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10373869 Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus Gordon M. Grivna 2019-08-06