Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10458957 | Ultrasonic device, ultrasonic module, and ultrasonic measuring device | Hiromu Miyazawa, Hiroshi Ito, Masayoshi Yamada, Kanechika KIYOSE, Tsukasa Funasaka | 2019-10-29 |
| 10453614 | Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor | Mikio Tahara | 2019-10-22 |
| 10441248 | Ultrasonic device, probe, electronic equipment, and ultrasonic image device | Yasunori Onishi, Tomohide Onogi | 2019-10-15 |
| 10385203 | Heat-curable resin composition for semiconductor encapsulation | Kazuaki Sumita, Naoyuki KUSHIHARA | 2019-08-20 |
| 10363574 | Piezoelectric element, probe, and ultrasonic measurement apparatus | Hiromu Miyazawa, Hiroshi Ito, Masayoshi Yamada, Jiro TSURUNO, Tsukasa Funasaka | 2019-07-30 |
| 10242924 | Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus | Hideki Akiba, Toshio Shiobara | 2019-03-26 |
| 10242801 | Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor | Kunihiko Nagaoka, Noriyuki Chigira | 2019-03-26 |
| 10224147 | Multilayer ceramic capacitor | Satoshi Kobayashi, Takahisa Fukuda | 2019-03-05 |
| 10172590 | Ultrasonic transducer device and ultrasonic measurement device | Jiro TSURUNO | 2019-01-08 |
| 10177059 | Method for manufacturing semiconductor apparatus using a base-attached encapsulant | Hideki Akiba, Toshio Shiobara | 2019-01-08 |