Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10407536 | Heat-curable resin composition for semiconductor encapsulation | Naoyuki KUSHIHARA | 2019-09-10 |
| 10385203 | Heat-curable resin composition for semiconductor encapsulation | Tomoaki Nakamura, Naoyuki KUSHIHARA | 2019-08-20 |