Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10308803 | Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof | Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada +1 more | 2019-06-04 |
| 10242924 | Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus | Tomoaki Nakamura, Hideki Akiba | 2019-03-26 |
| 10177059 | Method for manufacturing semiconductor apparatus using a base-attached encapsulant | Tomoaki Nakamura, Hideki Akiba | 2019-01-08 |