Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10367470 | Wafer-level-packaged BAW devices with surface mount connection structures | Matthew Wasilik, Ian Y. K. Yee, Bang Nguyen, Ebrahim Andideh, Robert Kraft | 2019-07-30 |
| 10315918 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Roland W. Gooch, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy | 2019-06-11 |
| 10262913 | Wafer level package solder barrier used as vacuum getter | Roland W. Gooch, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2019-04-16 |