Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10315918 | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays | Buu Q. Diep, Stephen H. Black, Thomas A. Kocian, Adam M. Kennedy | 2019-06-11 |
| 10262913 | Wafer level package solder barrier used as vacuum getter | Buu Q. Diep, Adam M. Kennedy, Stephen H. Black, Thomas A. Kocian | 2019-04-16 |