Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10367470 | Wafer-level-packaged BAW devices with surface mount connection structures | Buu Q. Diep, Ian Y. K. Yee, Bang Nguyen, Ebrahim Andideh, Robert Kraft | 2019-07-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10367470 | Wafer-level-packaged BAW devices with surface mount connection structures | Buu Q. Diep, Ian Y. K. Yee, Bang Nguyen, Ebrahim Andideh, Robert Kraft | 2019-07-30 |