VB

Venugopal Boynapalli

QU Qualcomm: 2 patents #659 of 2,470Top 30%
Overall (2019): #109,645 of 560,194Top 20%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10490543 Placement methodology to remove filler Xiangdong Chen, Sorin Adrian Dobre, Hyeokjin Lim 2019-11-26
10236886 Multiple via structure for high performance standard cells Satyanarayana Sahu, Xiangdong Chen, Hyeokjin Lim, Mickael Malabry, Mukul Gupta 2019-03-19