Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490543 | Placement methodology to remove filler | Xiangdong Chen, Sorin Adrian Dobre, Venugopal Boynapalli | 2019-11-26 |
| 10236886 | Multiple via structure for high performance standard cells | Satyanarayana Sahu, Xiangdong Chen, Venugopal Boynapalli, Mickael Malabry, Mukul Gupta | 2019-03-19 |
| 10175571 | Hybrid coloring methodology for multi-pattern technology | Xiangdong Chen, Ohsang Kwon, Mickael Malabry, Jingwei Zhang, Raymond George Stephany +5 more | 2019-01-08 |