Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431534 | Package with support structure | Gilles Montoriol, Trung Q. Duong, Akhilesh Kumar Singh, Navas Khan Oratti Kalandar | 2019-10-01 |
| 10217698 | Die attachment for packaged semiconductor device | Akhilesh Kumar Singh, Rama I. Hegde | 2019-02-26 |
| 10211184 | Apparatus and methods for multi-die packaging | Navas Khan Oratti Kalandar, Akhilesh Kumar Singh | 2019-02-19 |