Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10367071 | Method and structure for a large-grain high-k dielectric | — | 2019-07-30 |
| 10217698 | Die attachment for packaged semiconductor device | Akhilesh Kumar Singh, Nishant Lakhera | 2019-02-26 |