Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431534 | Package with support structure | Nishant Lakhera, Gilles Montoriol, Trung Q. Duong, Navas Khan Oratti Kalandar | 2019-10-01 |
| 10217698 | Die attachment for packaged semiconductor device | Rama I. Hegde, Nishant Lakhera | 2019-02-26 |
| 10211184 | Apparatus and methods for multi-die packaging | Nishant Lakhera, Navas Khan Oratti Kalandar | 2019-02-19 |