Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10219387 | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate | Leilei Zhang, Ronilo Boja, Abraham Yee | 2019-02-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10219387 | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate | Leilei Zhang, Ronilo Boja, Abraham Yee | 2019-02-26 |