Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10438863 | Chip package assembly with surface mounted component protection | Inderjit Singh | 2019-10-08 | $73,666,000 |
| 10219387 | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate | Leilei Zhang, Abraham Yee, Zuhair Bokharey | 2019-02-26 | $135,756,000 |