Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10219387 | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate | Ronilo Boja, Abraham Yee, Zuhair Bokharey | 2019-02-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10219387 | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate | Ronilo Boja, Abraham Yee, Zuhair Bokharey | 2019-02-26 |