MW

Manabu Watanabe

Nissan Motor Co.: 9 patents #1 of 737Top 1%
Fujitsu Limited: 2 patents #238 of 1,452Top 20%
YC Yamada Manufacturing Co.: 1 patents #6 of 34Top 20%
📍 Ota, JP: #2 of 126 inventorsTop 2%
Overall (2019): #5,944 of 560,194Top 2%
12
Patents 2019

Issued Patents 2019

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
10516161 Negative electrode active material for electric device and electric device using the same Tomohiro Kaburagi, Nobutaka Chiba, Humihiro Miki, Makoto Tanimura 2019-12-24
10505184 Negative electrode active material for electric device and electric device using the same Humihiro Miki, Tomohiro Kaburagi, Nobutaka Chiba 2019-12-10
10403890 Negative electrode active material for electric device and electric device using the same Nobutaka Chiba, Youichi Yoshioka, Tomohiro Kaburagi, Masaya Arai 2019-09-03
10396020 Method of manufacturing board Kei Fukui, Youichi Hoshikawa, Hiromitsu Kobayashi, Hidehiko Fujisaki, Seigo Yamawaki +3 more 2019-08-27
10367198 Negative electrode active material for electric device Masao Yoshida, Osamu Tanaka 2019-07-30
10340519 Negative electrode active material for electric device and electric device using the same Nobutaka Chiba, Tomohiro Kaburagi, Youichi Yoshioka, Masaya Arai 2019-07-02
10297360 Negative electrode active material for electric device and electric device using the same Tomohiro Kaburagi, Nobutaka Chiba, Humihiro Miki, Makoto Tanimura 2019-05-21
10290867 Negative electrode active material for electric device and electric device using same Fumihiro Miki, Nobutaka Chiba, Kei Kitaura, Tohru Wada 2019-05-14
10290855 Negative electrode for electrical device, and electrical device using the same Kensuke Yamamoto, Fumihiro Miki, Takashi Sanada, Nobutaka Chiba 2019-05-14
10288066 Oil pump with sloping extension portion between discharge Shimpei Iizuka, Hiroaki Sato, Kenji Kawashima 2019-05-14
10276866 Electric device Tomohiro Kaburagi, Youichi Yoshioka, Hirokazu Komatsu, Nobutaka Chiba, Shinji Yamamoto 2019-04-30
10181437 Package substrate and method of manufacturing package substrate Kenji Fukuzono, Yuki Hoshino, Masateru Koide 2019-01-15