Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10478050 | Operation device for into-bore introduction device, and into-bore introduction device | Hiroyuki Fukuda, Yasuo Funakoshi, Kota SUGAYA, Kenji Tajima | 2019-11-19 |
| 10444450 | Optical module | Takayoshi Matsumura, Naoaki Nakamura, Kenji Fukuzono, Norio Kainuma, Takashi Kubota +2 more | 2019-10-15 |
| 10418310 | BGA package substrate and method of manufacturing the same | Kenji Fukuzono | 2019-09-17 |
| 10181437 | Package substrate and method of manufacturing package substrate | Manabu Watanabe, Kenji Fukuzono, Masateru Koide | 2019-01-15 |