Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396020 | Method of manufacturing board | Kei Fukui, Youichi Hoshikawa, Hiromitsu Kobayashi, Hidehiko Fujisaki, Seigo Yamawaki +3 more | 2019-08-27 |
| 10181437 | Package substrate and method of manufacturing package substrate | Manabu Watanabe, Kenji Fukuzono, Yuki Hoshino | 2019-01-15 |