Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10498942 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao | 2019-12-03 |
| 10321028 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao +4 more | 2019-06-11 |
| 10230879 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao | 2019-03-12 |
| 10171716 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao | 2019-01-01 |