Issued Patents 2019
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10498942 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2019-12-03 |
| 10477088 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka | 2019-11-12 |
| 10461116 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Heng Jiang | 2019-10-29 |
| 10440247 | Camera module and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhen Huang | 2019-10-08 |
| 10412278 | System-level camera module with electrical support and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Feifan Chen, Liang Ding, Ye Wu +1 more | 2019-09-10 |
| 10353167 | Camera lens module with one or more optical lens modules and manufacturing method thereof | Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Bojie Zhao +1 more | 2019-07-16 |
| 10356299 | Camera module and electric holder and assembling method thereof | Mingzhu Wang, Feifan Chen, Bojie Zhao, Bo Peng, Zhen Huang | 2019-07-16 |
| 10321028 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao +4 more | 2019-06-11 |
| 10302892 | Camera lens module and manufacturing method thereof | Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Bojie Zhao +1 more | 2019-05-28 |
| 10281674 | Adjustable optical lens and camera module and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Liang Ding, Chunmei Liu, Feifan Chen +1 more | 2019-05-07 |
| 10274694 | Manufacturing method of a molded photosensitive assembly of an array imaging module | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Heng Jiang +4 more | 2019-04-30 |
| 10230879 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2019-03-12 |
| 10230876 | System-level camera module with encapsulated electrical support | Mingzhu Wang, Bojie Zhao, Feifan Chen, Liang Ding, Ye Wu +1 more | 2019-03-12 |
| 10228532 | Camera lens module and manufacturing method thereof | Mingzhu Wang, Heng Jiang, Feifan Chen, Chunmei Liu, Bojie Zhao +1 more | 2019-03-12 |
| 10222573 | Adjustable optical lens and camera module and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Liang Ding, Chunmei Liu, Feifan Chen +1 more | 2019-03-05 |
| 10212322 | Camera module and electric holder and assembling method thereof | Mingzhu Wang, Feifan Chen, Bojie Zhao, Bo Peng, Zhen Huang | 2019-02-19 |
| 10197890 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka, Zhen Huang +4 more | 2019-02-05 |
| 10194064 | Array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka | 2019-01-29 |
| 10192914 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei +4 more | 2019-01-29 |
| 10175447 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Heng Jiang +4 more | 2019-01-08 |
| 10171716 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2019-01-01 |