Issued Patents 2019
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10498942 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2019-12-03 |
| 10477088 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2019-11-12 |
| 10461116 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Heng Jiang, Nan Guo | 2019-10-29 |
| 10427945 | Ion sieve material, and methods of preparing and using the same | Wei Hu, Fanghua Chen, Weihua Wan, Peng Zhou, Yunfei Zhang | 2019-10-01 |
| 10321028 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang +4 more | 2019-06-11 |
| 10274694 | Manufacturing method of a molded photosensitive assembly of an array imaging module | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2019-04-30 |
| 10230879 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2019-03-12 |
| 10197890 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2019-02-05 |
| 10194064 | Array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2019-01-29 |
| 10192914 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei +4 more | 2019-01-29 |
| 10175447 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2019-01-08 |
| 10171716 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2019-01-01 |