Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10197890 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka, Nan Guo +4 more | 2019-02-05 |