Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10300542 | Wire electrical discharge machining apparatus and method of manufacturing semiconductor wafer | Takashi Hashimoto, Takashi Yuzawa | 2019-05-28 |
| 10220459 | Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatus | Atsushi Itokazu, Takashi Hashimoto | 2019-03-05 |