Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10220459 | Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatus | Hidetaka Miyake, Takashi Hashimoto | 2019-03-05 |