Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10300542 | Wire electrical discharge machining apparatus and method of manufacturing semiconductor wafer | Hidetaka Miyake, Takashi Hashimoto | 2019-05-28 |
| 10222199 | Displacement sensor, displacement detection apparatus, and displacement detection method | Shigeru TAKUSHIMA, Hiroyuki Kawano, Makito Seki | 2019-03-05 |