Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431531 | Semiconductor dies with recesses, associated leadframes, and associated systems and methods | Chua Swee Kwang | 2019-10-01 |
| 10396059 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Meow Koon Eng, Suan Jeung Boon | 2019-08-27 |