Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396059 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2019-08-27 |