Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453704 | Method for packaging circuits | Chia Yong Poo, Low Siu Waf, Boon Suan Jeung, Eng Meow Koon | 2019-10-22 |
| 10431531 | Semiconductor dies with recesses, associated leadframes, and associated systems and methods | Yong Poo Chia | 2019-10-01 |