| 10475810 |
Conductive components and memory assemblies |
Sudip Bandyopadhyay, Keen Wah Chow, Devesh Kumar Datta, Anurag Jindal, David Ross Economy |
2019-11-12 |
| 10446727 |
Ohmic contacts for semiconductor structures |
Yongjun Jeff Hu, Shanming Mou, Everett A. McTeer |
2019-10-15 |
| 10424596 |
Conductive structures and assemblies having vertically-stacked memory cells over conductive structures |
Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook |
2019-09-24 |
| 10361214 |
Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structures |
Jordan D. Greenlee, Everett A. McTeer |
2019-07-23 |
| 10361216 |
Methods used in forming an array of elevationally-extending transistors |
Jordan D. Greenlee, E. Allen McTeer |
2019-07-23 |
| 10355014 |
Assemblies having vertically-extending structures |
David Ross Economy, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz, Daniel Billingsley +1 more |
2019-07-16 |
| 10354989 |
Integrated assemblies and methods of forming integrated assemblies |
Daniel Billingsley, Everett A. McTeer, Christopher W. Petz, Haoyu Li, Yongjun Jeff Hu |
2019-07-16 |
| 10344398 |
Source material for electronic device applications |
Yushi Hu, Yongjun Jeff Hu, Everett A. McTeer |
2019-07-09 |
| 10304749 |
Method and apparatus for improved etch stop layer or hard mask layer of a memory device |
Christopher W. Petz, Philip M. Campbell, Wei Yeeng Ng, Kunal Shrotri, Saurabh Keshav +2 more |
2019-05-28 |
| 10283524 |
Methods of filling horizontally-extending openings of integrated assemblies |
Jordan D. Greenlee, Chet E. Carter, Collin Howder, Everett A. McTeer |
2019-05-07 |
| 10217936 |
Apparatuses including electrodes having a conductive barrier material and methods of forming same |
Swapnil Lengade, Andrea Gotti |
2019-02-26 |
| 10170493 |
Assemblies having vertically-stacked conductive structures |
Jordan D. Greenlee, Everett A. McTeer |
2019-01-01 |
