Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354989 | Integrated assemblies and methods of forming integrated assemblies | Everett A. McTeer, Christopher W. Petz, Haoyu Li, John Mark Meldrim, Yongjun Jeff Hu | 2019-07-16 |
| 10355014 | Assemblies having vertically-extending structures | David Ross Economy, John Mark Meldrim, Haoyu Li, Yongjun Jeff Hu, Christopher W. Petz +1 more | 2019-07-16 |
| 10199531 | Semiconductor heterostructure with stress management | Robert M. Kennedy, Wenhong Sun, Rakesh Jain, Maxim S. Shatalov, Alexander Dobrinsky +2 more | 2019-02-05 |