Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522515 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, Tracy V. Reynolds | 2019-12-31 |
| 10448509 | Electronic device assemblies including conductive vias having two or more conductive elements | Choon Kuan Lee, Chin Hui Chong | 2019-10-15 |
| 10312173 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | Matt E. Schwab, J. Michael Brooks | 2019-06-04 |
| 10297574 | System in package (SIP) with dual laminate interposers | Matt E. Schwab | 2019-05-21 |
| 10256214 | Computer modules with small thicknesses and associated methods of manufacturing | Kevin Gibbons, Tracy V. Reynolds | 2019-04-09 |
| 10211114 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | Chin Hui Chong, Choon Kuan Lee | 2019-02-19 |