Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312173 | Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components | J. Michael Brooks, David J. Corisis | 2019-06-04 |
| 10297574 | System in package (SIP) with dual laminate interposers | David J. Corisis | 2019-05-21 |