Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10448509 | Electronic device assemblies including conductive vias having two or more conductive elements | David J. Corisis, Chin Hui Chong | 2019-10-15 |
| 10431513 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices | Seng Kim Ye, Chin Hui Chong, Wang Lai Lee, Roslan Bin Said | 2019-10-01 |
| 10211114 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | David J. Corisis, Chin Hui Chong | 2019-02-19 |