Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510560 | Method of encapsulating a substrate | Kwang Hong Lee, Eng Kian Kenneth Lee, Chuan Seng Tan, Viet Cuong Nguyen | 2019-12-17 |
| 10510581 | Methods of forming strained-semiconductor-on-insulator device structures | Thomas A. Langdo, Matthew T. Currie, Richard Hammond, Anthony J. Lochtefeld | 2019-12-17 |
| 10483351 | Method of manufacturing a substrate with reduced threading dislocation density | Kwang Hong Lee, Chuan Seng Tan, Shuyu Bao | 2019-11-19 |
| 10418273 | Method of manufacturing a germanium-on-insulator substrate | Kwang Hong Lee, Chuan Seng Tan, Shuyu Bao, Yiding Lin, Jurgen Michel | 2019-09-17 |