Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510560 | Method of encapsulating a substrate | Kwang Hong Lee, Chuan Seng Tan, Eugene A. Fitzgerald, Viet Cuong Nguyen | 2019-12-17 |
| 10324256 | Method of forming an integrated circuit and related integrated circuit | Wenjia Zhang, Bing Wang, Li Zhang, Zhaomin Zhu, Jurgen Michel +3 more | 2019-06-18 |