Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510560 | Method of encapsulating a substrate | Kwang Hong Lee, Eng Kian Kenneth Lee, Eugene A. Fitzgerald, Viet Cuong Nguyen | 2019-12-17 |
| 10483351 | Method of manufacturing a substrate with reduced threading dislocation density | Kwang Hong Lee, Eugene A. Fitzgerald, Shuyu Bao | 2019-11-19 |
| 10418273 | Method of manufacturing a germanium-on-insulator substrate | Kwang Hong Lee, Eugene A. Fitzgerald, Shuyu Bao, Yiding Lin, Jurgen Michel | 2019-09-17 |