MN

Mei Zhen Ng

LM Lockheed Martin: 1 patents #83 of 341Top 25%
📍 Singapore, SG: #448 of 1,836 inventorsTop 25%
Overall (2019): #348,111 of 560,194Top 65%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10202512 Conductive paste, method for forming an interconnection and electrical device Byung Hoon Lee, Chee Lip Gan, Alfred A. Zinn 2019-02-12