Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10357943 | Articles having an exposed surface coating formed from copper nanoparticles | — | 2019-07-23 |
| 10283482 | Wire bonding methods and systems incorporating metal nanoparticles | Randall M. Stoltenberg | 2019-05-07 |
| 10202512 | Conductive paste, method for forming an interconnection and electrical device | Byung Hoon Lee, Chee Lip Gan, Mei Zhen Ng | 2019-02-12 |