Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10202512 | Conductive paste, method for forming an interconnection and electrical device | Byung Hoon Lee, Mei Zhen Ng, Alfred A. Zinn | 2019-02-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10202512 | Conductive paste, method for forming an interconnection and electrical device | Byung Hoon Lee, Mei Zhen Ng, Alfred A. Zinn | 2019-02-12 |