Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354890 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Benjamin Stassen Cook | 2019-07-16 |
| 10347508 | Printed adhesion deposition to mitigate integrated circuit delamination | Rongwei Zhang, Benjamin Stassen Cook, Abram Castro | 2019-07-09 |