Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10455308 | Die with integrated microphone device using through-silicon vias (TSVs) | Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Valluri Rao, Nicholas P. Cowley | 2019-10-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10455308 | Die with integrated microphone device using through-silicon vias (TSVs) | Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Valluri Rao, Nicholas P. Cowley | 2019-10-22 |