Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10262915 | Thermally enhanced semiconductor package with thermal additive and process for making the same | Julio C. Costa, George Maxim, Dirk Robert Walter Leipold, Baker Scott, Merrill Albert Hatcher, Jr. | 2019-04-16 |